PART |
Description |
Maker |
MK2761ASTR MK2761A MK2761AS MK2761ASLF MK2761ASLFT |
Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body)
|
ICST[Integrated Circuit Systems]
|
SC70-5 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
AP2301BGN-HF AP2301BGN-HF-14 |
2.8 A, 20 V, 0.13 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp. Advanced Power Electron...
|
TQFN5X5-32 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN3X6-32 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN5X5-20 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN4X4-28 |
Package Outline
|
Global Mixed-mode Techn...
|
WLCSP8X8-64 |
Package Outline
|
Global Mixed-mode Techn...
|
SOT223 |
Package Outline
|
Global Mixed-mode Techn...
|
TSSOP-24 |
Package Outline
|
Global Mixed-mode Techn...
|
TSSOP-14-EP |
Package Outline
|
Global Mixed-mode Techn...
|
TSSOP-16-EP |
Package Outline
|
Global Mixed-mode Techn...
|